Legal Designation: Texas Registered LLC

Summary: BucklingBeam manufactures probe card test apparatus’ and test sockets for the semiconductor industry. The companys core technology was developed by IBM® and is utilized in 80% of the worlds flip chip wafer test applications. This technology is also suited for WLCSP (Wafer Level Chip Scale Package) test applications as device interconnect geometries shrink beyond conventional socket industry solutions. Both segments are expected to grow significantly over the next decade as more device applications evolve to direct attach components for electronic devices and systems. While BucklingBeam product interconnects are presently based upon mature technology, further scaling and evolutionary development should enable the company to continue to emerge as a serious source for semiconductor test contact solutions.