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...to grow every year throughout some of the toughest times the industry has faced.  

 

 

About BB

 

 

Our initial business model was developed in response to industry demand over the years for lower probe hardware pricing. Within our brief history, we have not only achieved this initial goal but have also emerged as a supplier of the highest quality and most challenging vertical probe applications in the industry.  

About Our Wafer Test Technology 

 

Original buckling beam vertical probe technology developed by IBM is here to stay. The true capabilities and even limitations of this amazing solution have yet to be fully determined. Effective design for performance principles are pushing the performance aspects beyond the next level. Our technology is used to test the vast majority of the flip chip semiconductor segment. While some competitors have developed alternative test contact solutions, this core technology still remains at the forefront of their product portfolios.   

About Our Package Test Technology

While conventional package interconnect technologies are limited to ~ .4mm, BucklingBeam solutions start at .4mm but can scale down to .15mm today. We incorporate the same time proven technology that has been the core wafer test contact solution in the industry for years. 

For device characterization and FA, we offer a standard low cost Kelvin solution at .4mm with even smaller pitch levels possible.

Our multi-dut QFN solutions incorporate redundant contacts in the place of a single pogo designs. If you have contact reliability challenges at any pitch, we have alternative solutions to industry standard technology.

 

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