About BucklingBeam

Our initial business model was developed in response to industry demands over the years for lower probe hardware pricing. Within our brief history, we have driven total wafer test costs to levels never before seen for partner customers. BucklingBeam is the only company to date to not only meet this request but to embrace it. We are your low cost leaders but more importantly your low cost drivers. We can grow our company and invest in advanced product development at the pricing levels achieved due to our company management philosophy and structure.

Although product cost is a primary focus, we recognize technology solution “total cost of ownership” is key to our customers’ achieving and maintaining a competitive edge. What makes us different is we combine the best, most reliable, most flexible and scalable vertical technology solutions available at lower unit costs than are available anywhere in the world. Lower unit cost and lower cost of ownership without sacrificing performance separates us from the rest of the industry.

Strategic partnerships are in the works and global support structures will be announced soon. Call us today for more information and to discuss your specific needs and requirements.

About Our Wafer Test Technology

Standardized buckling beam vertical probe technology is here to stay and the true capabilities and even limitations of this amazing solution have yet to be determined. Just ask anyone who is probing C4 interconnect devices and why they aren't using "advanced" solutions. The picture will quickly become clear.

A fundamental requirement of any vertical technology should be repair or contact replacement capability. Competitive "advanced" solutions do not provide this feature. BucklingBeam is working to provide not only optimized probe contact solutions for today's and tomorrow's interconnect challenges, but is also incorporating the advantages of standard buckling beam flexibility. New application specific product solutions including a 130um pitch capable area array advanced technology are in development and will be released in 2010. (This is updated from the previous release target of early 2010.)

About Our Package Test Technology

While conventional package interconnect technologies are limited to ~ .4mm, BucklingBeam solutions start at .4mm but can scale down to .15mm today. We incorporate the same time proven technology that has been the core wafer test contact solution in the industry for years.

For device characterization and FA, we offer a standard low cost Kelvin solution at .4mm with even smaller pitch levels possible.

Bare Die Testing? Click on the package test link from our home page and describe your requirements.

Our multi-dut QFN solutions incorporate redundant contacts in the place of a single pogo designs. If you have contact reliability challenges at any pitch, we have alternative solutions to industry standard technology.